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Discrete Semiconductor Products

RF05VYM2SFHTR

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Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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Product dimension image
Discrete Semiconductor Products

RF05VYM2SFHTR

Active
Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

SpecificationRF05VYM2SFHTR
Current - Average Rectified (Io)500 mA
Current - Reverse Leakage @ Vr10 ÁA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / Case2-SMD, Flat Leads
QualificationAEC-Q101
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If [Max]980 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 14304$ 0.34

Description

General part information

RF05VYM2SFH Series

RF05VYM2S is small mold type fast recovery diode for high frequency rectification.

Documents

Technical documentation and resources

How to Select Rectifier Diodes

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

RF05VYM2SFH Data Sheet

Data Sheet

List of Diode Package Thermal Resistance

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

About Flammability of Materials

Environmental Data

Taping Information

Package Information

Explanation for Marking

Package Information

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Diode Types and Applications

Technical Article

ESD Data

Characteristics Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

Inner Structure

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article