Discrete Semiconductor Products

MMIX1T550N055T2

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DISC MSFT SMPD PKG-HIPERFETMSFT SMPD-B/ TUBE

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DocumentsMMIX1T550N055T2 | Datasheet ISOPLUS – SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs White Paper +4

Discrete Semiconductor Products

MMIX1T550N055T2

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LITTELFUSE

DISC MSFT SMPD PKG-HIPERFETMSFT SMPD-B/ TUBE

Deep-Dive with AI

DocumentsMMIX1T550N055T2 | Datasheet ISOPLUS – SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs White Paper +4

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	MMIX1T550N055T2

Current - Continuous Drain (Id) @ 25°C	550 A
Drain to Source Voltage (Vdss)	55 V
Drive Voltage (Max Rds On, Min Rds On)	10 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs	595 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]	40000 pF
Mounting Type	Surface Mount
Operating Temperature [Max]	175 °C
Operating Temperature [Min]	-55 °C
Package / Case	24-PowerSMD, 21 Leads
Power Dissipation (Max)	830 W
Rds On (Max) @ Id, Vgs	1.3 mOhm
Supplier Device Package	24-SMPD
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	3.8 V

MMIX1T550 Series

Part	Drive Voltage (Max Rds On, Min Rds On)	Gate Charge (Qg) (Max) @ Vgs	Vgs(th) (Max) @ Id	Vgs (Max)	Package / Case	Current - Continuous Drain (Id) @ 25°C	Supplier Device Package	Power Dissipation (Max)	Input Capacitance (Ciss) (Max) @ Vds [Max]	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Technology	Rds On (Max) @ Id, Vgs	Drain to Source Voltage (Vdss)	FET Type
LITTELFUSE MMIX1T550N055T2	10 V	595 nC	3.8 V	20 V	24-PowerSMD 21 Leads	550 A	24-SMPD	830 W	40000 pF	Surface Mount	175 °C	-55 °C	MOSFET (Metal Oxide)	1.3 mOhm	55 V	N-Channel

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	N/A	0	$ 47.78	1m+
	Tube	1	$ 48.78	1m+
		20	$ 43.46
		100	$ 38.15
Newark	Each	250	$ 35.35	1m+

Description

General part information

MMIX1T550 Series

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single

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Technical documentation and resources