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Discrete Semiconductor Products

HP8KE6TB1

Active
Rohm Semiconductor

DUAL MOSFET, N-CH, 100V, 17A, HSOP ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

HP8KE6TB1

Active
Rohm Semiconductor

DUAL MOSFET, N-CH, 100V, 17A, HSOP ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationHP8KE6TB1
Configuration2 N-Channel, 2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C6 A, 17 A
Drain to Source Voltage (Vdss)100 V
Gate Charge (Qg) (Max) @ Vgs6.7 nC
Input Capacitance (Ciss) (Max) @ Vds305 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power - Max3 W, 21 W
Rds On (Max) @ Id, Vgs54 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.31
10$ 1.49
100$ 1.01
500$ 0.81
1000$ 0.74
Digi-Reel® 1$ 2.31
10$ 1.49
100$ 1.01
500$ 0.81
1000$ 0.74
N/A 2403$ 2.30
Tape & Reel (TR) 2500$ 0.67
5000$ 0.64
NewarkEach (Supplied on Cut Tape) 1$ 0.90

Description

General part information

HP8KE6 Series

HP8KE6 is a low on-resistance MOSFET ideal for switching applications.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

P-channel Power MOSFETs selection guide

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

HSOP8(Symmetry Dual) Condition of Soldering / Land Pattern Reference

Package Information

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Package Dimensions

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

HP8KE6 Data Sheet

Data Sheet

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Types and Features of Transistors

Application Note

What Is Thermal Design

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

HP8KE6 ESD Data

Characteristics Data

Explanation for Marking

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice® Models

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design