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Discrete Semiconductor Products

RQ3L070BGTB1

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Rohm Semiconductor

NCH 60V 20A, HSMT8G, POWER MOSFET

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Product dimension image
Discrete Semiconductor Products

RQ3L070BGTB1

Active
Rohm Semiconductor

NCH 60V 20A, HSMT8G, POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ3L070BGTB1
Current - Continuous Drain (Id) @ 25°C20 A, 7 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]7.6 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]460 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)2 W, 15 W
Rds On (Max) @ Id, Vgs24.7 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 309$ 0.84

Description

General part information

RQ3L070BG Series

RQ3L070BG is a power MOSFET with low on-resistance, suitable for Primary side switch, motor drives, DC/DC converter.

Documents

Technical documentation and resources

List of Transistor Package Thermal Resistance

Thermal Design

HSMT8(TB1) Explanation for Marking

Package Information

RQ3L070BG ESD Data

Characteristics Data

Part Explanation

Application Note

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

RQ3L070BG Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

HSMT8(TB1) Dimension

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

HSMT8 Single Cu Inner Structure

Package Information

Types and Features of Transistors

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

HSMT8(TB1) Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design