Specification	TMM-117-01-L-S

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Length - Mating	3.2 mm
Contact Length - Mating	0.126 "
Contact Length - Post	3.5 mm
Contact Length - Post	0.138 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3.2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	1.5 mm
Insulation Height	0.059 "
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	8.2 mm
Overall Contact Length	0.323 in
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TMM-117 Series

Part	Contact Material	Insulation Material	Insulation Height	Insulation Height	Contact Length - Post [x]	Contact Length - Post [x]	Number of Rows	Connector Type	Overall Contact Length	Overall Contact Length	Style	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Finish - Post	Mounting Type	Fastening Type	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Shrouding	Current Rating (Amps)	Insulation Color	Contact Shape	Pitch - Mating [x]	Pitch - Mating [x]	Contact Length - Mating	Contact Length - Mating	Contact Type	Termination	Number of Positions	Material Flammability Rating	Row Spacing - Mating	Row Spacing - Mating	Features	Contact Length - Post	Contact Length - Post	Overall Contact Length	Contact Length - Mating [x]	Contact Length - Mating [x]
Samtec Inc. TMM-117-03-G-S	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "	0.106 in	2.69 mm	1	Header	8.2 mm	0.323 in	Board to Board Cable	0.51 µm	20 µin	Gold	Gold	Through Hole	Push-Pull	All	3 µin	0.076 µm	-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	4 mm	0.157 in	Male Pin	Solder
Samtec Inc. TMM-117-01-F-D-SM	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "			2	Header			Board to Board Cable	0.076 µm	3 µin	Gold	Tin	Surface Mount	Push-Pull	All			-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	3.2 mm	0.126 "	Male Pin	Solder	34	UL94 V-0	0.079 in	2 mm
Samtec Inc. TMM-117-01-S-D-SM-P-TR	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "			2	Header			Board to Board Cable	0.76 Ám	30 Áin	Gold	Tin	Surface Mount	Push-Pull	All			-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	3.2 mm	0.126 "	Male Pin	Solder	34	UL94 V-0	0.079 in	2 mm	Pick and Place
Samtec Inc. TMM-117-01-L-S	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "			1	Header	8.2 mm	0.323 in	Board to Board Cable	0.25 çm	10 çin	Gold	Tin	Through Hole	Push-Pull	All			-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	3.2 mm	0.126 "	Male Pin	Solder						3.5 mm	0.138 in
Samtec Inc. TMM-117-04-G-D	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "			2	Header		5.69 mm	Board to Board Cable	0.51 µm	20 µin	Gold	Gold	Through Hole	Push-Pull	All	3 µin	0.076 µm	-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm			Male Pin	Solder	34		0.079 in	2 mm		2.29 mm	0.09 "	0.224 in	1.9 mm	0.075 in
Samtec Inc. TMM-117-06-L-D-SM-A	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "			2	Header			Board to Board Cable	0.25 çm	10 çin	Gold	Tin	Surface Mount	Push-Pull	All			-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	4.27 mm	0.168 in	Male Pin	Solder	34	UL94 V-0	0.079 in	2 mm	Board Guide
Samtec Inc. TMM-117-01-F-D-SM-A	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "			2	Header			Board to Board Cable	0.076 µm	3 µin	Gold	Tin	Surface Mount	Push-Pull	All			-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	3.2 mm	0.126 "	Male Pin	Solder	34	UL94 V-0	0.079 in	2 mm	Board Guide
Samtec Inc. TMM-117-03-G-D	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "	0.106 in	2.69 mm	2	Header	8.2 mm	0.323 in	Board to Board Cable	0.51 µm	20 µin	Gold	Gold	Through Hole	Push-Pull	All	3 µin	0.076 µm	-55 °C	125 °C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	4 mm	0.157 in	Male Pin	Solder	34		0.079 in	2 mm
Samtec Inc. TMM-117-01-T-S-RE	Phosphor Bronze	Liquid Crystal Polymer (LCP)	2 mm	0.079 in	0.12 in	3.05 mm	1	Header			Board to Board Cable				Tin	Through Hole Right Angle	Push-Pull	All			-55 °C	105 ░C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	3.2 mm	0.126 "	Male Pin	Solder
Samtec Inc. TMM-117-03-T-Q	Phosphor Bronze	Liquid Crystal Polymer (LCP)	1.5 mm	0.059 "	0.106 in	2.69 mm		Header	8.2 mm	0.323 in	Board to Board Cable				Tin	Through Hole	Push-Pull	All			-55 °C	105 ░C	Unshrouded	3.2 A	Black	Square	0.079 in	2 mm	4 mm	0.157 in	Male Pin	Solder	68		0.079 in	2 mm