Integrated Circuits (ICs)

MPC8313ECVRAGDC

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IC MPU POWERQUICC II PRO 516PBGA

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Integrated Circuits (ICs)

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IC MPU POWERQUICC II PRO 516PBGA

Technical Specifications

Parameters and characteristics for this part

Specification	MPC8313ECVRAGDC

Additional Interfaces	SPI, PCI, DUART, HSSI, I2C
Co-Processors/DSP	SEC 2.2, Security
Core Processor	PowerPC e300c3
Ethernet	10 Mbps, 1000 Mbps, 100 Mbps
Ethernet	2
Graphics Acceleration	False
Mounting Type	Surface Mount
Number of Cores/Bus Width	32 Bit, 1 Core
Operating Temperature [custom]	-40 °C, 105 °C
Package / Case	516-BBGA Exposed Pad
RAM Controllers	DDR2, DDR
Security Features	MD5, DES, AES, SHA-1, 3DES
Speed	400 MHz
Supplier Device Package	516-TEPBGA (27x27)
USB	USB 2.0 + PHY (1)
Voltage - I/O	2.5 V, 3.3 V, 1.8 V

Part	Mounting Type	Supplier Device Package	Package / Case	Co-Processors/DSP	Number of Cores/Bus Width	RAM Controllers	Ethernet	Ethernet	Security Features	Speed	USB	Voltage - I/O	Core Processor	Additional Interfaces	Operating Temperature [custom]	Operating Temperature [Max]	Operating Temperature [Min]
Freescale Semiconductor - NXP MPC8313EVRADDC	Surface Mount	516-TEPBGA (27x27)	516-BBGA Exposed Pad
Freescale Semiconductor - NXP MPC8313ECVRAGDC	Surface Mount	516-TEPBGA (27x27)	516-BBGA Exposed Pad	SEC 2.2 Security	1 Core 32 Bit	DDR DDR2	10 Mbps 100 Mbps 1000 Mbps	2	3DES AES DES MD5 SHA-1	400 MHz	USB 2.0 + PHY (1)	1.8 V 2.5 V 3.3 V	PowerPC e300c3	DUART HSSI I2C PCI SPI	-40 °C 105 °C
Freescale Semiconductor - NXP MPC8313ECVRAFFC	Surface Mount	516-TEPBGA (27x27)	516-BBGA Exposed Pad	SEC 2.2 Security	1 Core 32 Bit	DDR DDR2	10 Mbps 100 Mbps 1000 Mbps	2	Cryptography	333 MHz	USB 2.0 + PHY (1)	1.8 V 2.5 V 3.3 V	PowerPC e300c3	DUART HSSI I2C PCI SPI		105 °C	-40 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Microprocessor IC * 516-TEPBGA (27x27)

Technical documentation and resources