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EMD2
Discrete Semiconductor Products

RB510SM-40T2R

Active
Rohm Semiconductor

40V, 100MA, SOD-523, SCHOTTKY BARRIER DIODE

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EMD2
Discrete Semiconductor Products

RB510SM-40T2R

Active
Rohm Semiconductor

40V, 100MA, SOD-523, SCHOTTKY BARRIER DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRB510SM-40T2R
Current - Average Rectified (Io)100 mA
Current - Reverse Leakage @ Vr2 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSC-79, SOD-523
Speed200 mA
SpeedAny Speed
Supplier Device PackageEMD2
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V
Voltage - Forward (Vf) (Max) @ If480 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.19
10$ 0.11
100$ 0.07
500$ 0.05
1000$ 0.04
2000$ 0.04
Digi-Reel® 1$ 0.19
10$ 0.11
100$ 0.07
500$ 0.05
1000$ 0.04
2000$ 0.04
N/A 19601$ 0.12
Tape & Reel (TR) 8000$ 0.03
16000$ 0.03
24000$ 0.03
40000$ 0.02
56000$ 0.02
80000$ 0.02
200000$ 0.02
400000$ 0.02

Description

General part information

RB510 Series

RB510SM-40 is low VFhigh reliability Schottky Barrier Diode, suitable for small current rectification.

Documents

Technical documentation and resources

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

RB510SM-40 Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Taping Information

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Regulations

Export Information

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Reliability Test Result

Manufacturing Data

ESD Data

Characteristics Data

What Is Thermal Design

Thermal Design

Diode Types and Applications

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Compliance of the RoHS directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Part Explanation

Application Note

Anti-Whisker formation - Diodes

Package Information

Inner Structure

Package Information

How to Create Symbols for PSpice Models

Models

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Select Rectifier Diodes

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Explanation for Marking

Package Information

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design