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UQFN56BV7070
Integrated Circuits (ICs)

BD71847AMWV-E2

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Rohm Semiconductor

SYSTEM PMIC FOR I.MX 8M MINI FAMILY

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UQFN56BV7070
Integrated Circuits (ICs)

BD71847AMWV-E2

Active
Rohm Semiconductor

SYSTEM PMIC FOR I.MX 8M MINI FAMILY

Technical Specifications

Parameters and characteristics for this part

SpecificationBD71847AMWV-E2
Frequency - Switching2 MHz
Mounting TypeSurface Mount
Number of Outputs12
Operating Temperature [Max]105 °C
Operating Temperature [Min]-40 °C
Package / Case56-VFQFN Exposed Pad
Supplier Device PackageUQFN56BV7070
TopologyLinear (LDO) (6), Step-Down (Buck) (6)
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]2.75 V
Voltage/Current - Output 13 A
Voltage/Current - Output 1 [Max]1.3 V
Voltage/Current - Output 1 [Min]0.7 V
Voltage/Current - Output 23 A
Voltage/Current - Output 2 [Max]1.3 V
Voltage/Current - Output 2 [Min]0.7 V
Voltage/Current - Output 33 A
Voltage/Current - Output 3 [Max]1.35 V
Voltage/Current - Output 3 [Min]0.7 V
w/LED DriverFalse
w/SequencerTrue
w/SupervisorFalse

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.58
10$ 3.73
100$ 2.67
500$ 2.22
Digi-Reel® 1$ 5.58
10$ 3.73
100$ 2.67
500$ 2.22
N/A 12929$ 5.55
Tape & Reel (TR) 1500$ 2.10

Description

General part information

BD71847 Series

BD71847AMWV integrates all power rails required by i.MX 8M Mini processors and system peripherals. In addition to integrate a sequencer compatible with power modes supported by i.MX 8M Mini processors, making it possible to significantly reduce the development time, decrease size, and simplify application design.The power supply circuit of the BD71847AMWV, designed specifically for the power supply system of the i.MX 8M Mini processor family, integrates an 6 buck converters, 6 LDOs, and control logic that allows it to supply power not only to the processor, but the required DDR memory as well – all from a single chip. A 1.8V/3.3V power switch for SDXC cards is also built in, along with a 32.768kHz crystal oscillator driver and multiple protection circuits such as output short-circuit, output over-voltage/current, and thermal shutdown.Buck conversion efficiency from 83 to 95% is achieved for 0.7V to 3.3V output, and the wide input voltage range from 2.7V to 5.5V supports a variety of power sources, from batteries to USB, making them ideal for i.MX 8M Mini applications.Furthermore, when single-sided mounting and Type-3 PCB is assumed, 42 fewer parts are needed compared with discrete solutions, reducing PCB area by up to 42%.

Documents

Technical documentation and resources

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Errata information on product BD71847MWV

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

BD71847AMWV Frequently Asked Questions

Application Note

Thermal Resistance

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Factory Information

Manufacturing Data

Enhancing Efficiency By Reducing Converter Stages & RON In Power Management ICs

White Paper

Five Steps for Successful Thermal Design of IC

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

ISO 26262: Functional Safety Standard for Modern Road Vehicles

White Paper

UQFN56BV7070 Package Information

Package Information

BD71847AMWV 1x22μF Buck Output Capacitor

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

How to Use the Two-Resistor Model

Thermal Design

BD71847AMWV Reference Schematic Data

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

BD71847AMWV Data Sheet

Data Sheet

Platform Design Guide

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design