Integrated Circuits (ICs)

R7F701391EAFP-C#BA1

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32BIT MCU RH850/P1L-C LQFP80

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Integrated Circuits (ICs)

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32BIT MCU RH850/P1L-C LQFP80

Technical Specifications

Parameters and characteristics for this part

Specification	R7F701391EAFP-C#BA1

Connectivity	UART/USART, CSI, SPI, LINbus, CANbus
Core Processor	RH850G3M
Core Size	32 Bit
Core Size	Dual-Core
Data Converters	A/D 10x12b SAR
EEPROM Size	32K x 8
Mounting Type	Surface Mount
Number of I/O	49
Operating Temperature [Max]	160 °C
Operating Temperature [Min]	-40 C
Oscillator Type	Internal
Package / Case	80-LQFP
Peripherals	Temp Sensor, DMA
Program Memory Size	512 KB
Program Memory Type	FLASH
RAM Size	64 K
Speed	120 MHz
Supplier Device Package	80-LFQFP (12x12)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

Part	Connectivity	Oscillator Type	RAM Size	Core Size	Core Size	Data Converters	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Operating Temperature [Min]	Operating Temperature [Max]	EEPROM Size	Speed	Package / Case	Program Memory Size	Number of I/O	Program Memory Type	Core Processor	Peripherals	Supplier Device Package	Mounting Type
Renesas Electronics Corporation R7F701391EAFP-C#BA1	CANbus CSI LINbus SPI UART/USART	Internal	64 K	32 Bit	Dual-Core	A/D 10x12b SAR	5.5 V	3 V	-40 C	160 °C	32K x 8	120 MHz	80-LQFP	512 KB	49	FLASH	RH850G3M	DMA Temp Sensor	80-LFQFP (12x12)	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3M RH850/PxL-C Microcontroller IC 32-Bit Dual-Core 120MHz 512KB (512K x 8) FLASH 80-LFQFP (12x12)

Technical documentation and resources

No documents available