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HS8K11TB
Discrete Semiconductor Products

HS8K11TB

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Rohm Semiconductor

TRANSISTOR MOSFET ARRAY DUAL N-CH 30V 7A/11A 10-PIN HSML3030 EMBOSS T/R

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HS8K11TB
Discrete Semiconductor Products

HS8K11TB

Active
Rohm Semiconductor

TRANSISTOR MOSFET ARRAY DUAL N-CH 30V 7A/11A 10-PIN HSML3030 EMBOSS T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationHS8K11TB
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C11 A, 7 A
Drain to Source Voltage (Vdss)30 V
FET FeatureLogic Level Gate
Gate Charge (Qg) (Max) @ Vgs11.1 nC
Input Capacitance (Ciss) (Max) @ Vds500 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-UDFN Exposed Pad
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs17.9 mOhm
Supplier Device PackageHSML3030L10
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.61
10$ 0.53
100$ 0.37
500$ 0.31
1000$ 0.26
Digi-Reel® 1$ 0.61
10$ 0.53
100$ 0.37
500$ 0.31
1000$ 0.26
N/A 195$ 1.00
Tape & Reel (TR) 3000$ 0.20

Description

General part information

HS8K11 Series

HS8K11 is standard MOSFET for switching application.

Documents

Technical documentation and resources

Transistor, MOSFET Flammability

Related Document

HSML3030L10 TB Taping Spec

Datasheet

HSML10 Part Marking

Related Document

HSML10D Inner Structure

Related Document

About Export Regulations

Export Information

Moisture Sensitivity Level - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Constitution Materials List

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Compliance of the RoHS directive

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Part Explanation

Application Note

Package Dimensions

Package Information

HS8K11 Reference Circuit (DC-DC Step-Down Converter 3P-Interleave Vo=5V Io=15A)

Reference Design

Types and Features of Transistors

Application Note

ESD Data

Characteristics Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

HS8K11 Data Sheet

Data Sheet

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

HS8K11 Reference Circuit (DC-DC Step-Down Converter 1P Vo=5V Io=5A)

Reference Design

HS8K11 Reference Circuit (DC-DC Step-Down Converter 2P-Interleave Vo=5V Io=10A)

Reference Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design