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Discrete Semiconductor Products

UMH33NTN

Active
Rohm Semiconductor

NPN+NPN, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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Product thumbnail image
Discrete Semiconductor Products

UMH33NTN

Active
Rohm Semiconductor

NPN+NPN, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationUMH33NTN
Current - Collector (Ic) (Max) [Max]400 mA
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]820
Frequency - Transition35 MHz
Mounting TypeSurface Mount
Package / CaseSOT-363, SC-88, 6-TSSOP
Resistor - Base (R1)2.2 kOhm
Supplier Device PackageUMT6
Transistor Type2 NPN - Pre-Biased (Dual)
Vce Saturation (Max) @ Ib, Ic100 mV
Voltage - Collector Emitter Breakdown (Max) [Max]20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.81
10$ 0.50
100$ 0.32
500$ 0.25
1000$ 0.22
Digi-Reel® 1$ 0.81
10$ 0.50
100$ 0.32
500$ 0.25
1000$ 0.22
Tape & Reel (TR) 3000$ 0.19
6000$ 0.18
9000$ 0.17
15000$ 0.16
21000$ 0.15
30000$ 0.15

Description

General part information

UMH33N Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Inner Structure

Package Information

Reliability Test Result

Manufacturing Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

UMH33N Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What Is Thermal Design

Thermal Design

Part Explanation

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design