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Discrete Semiconductor Products

FMN1T148

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Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 25MA, 5PIN SWITCHING DIODE

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Discrete Semiconductor Products

FMN1T148

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 25MA, 5PIN SWITCHING DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationFMN1T148
Current - Average Rectified (Io) (per Diode)25 mA
Current - Reverse Leakage @ Vr100 nA
Diode Configuration2 Pair Common Cathode
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSOT-753, SC-74A
Reverse Recovery Time (trr)4 ns
Supplier Device PackageSMT5
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If [Max]900 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.67
10$ 0.41
100$ 0.26
500$ 0.20
1000$ 0.18
Digi-Reel® 1$ 0.67
10$ 0.41
100$ 0.26
500$ 0.20
1000$ 0.18
N/A 3064$ 0.49
Tape & Reel (TR) 3000$ 0.15
6000$ 0.14
9000$ 0.13
15000$ 0.13
21000$ 0.12
30000$ 0.12
75000$ 0.11

Description

General part information

FMN1 Series

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

FMN1 Data Sheet

Data Sheet

Moisture Sensitivity Level - Diodes

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Inner Structure

Package Information

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

Package Dimensions

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Reliability Test Result

Manufacturing Data

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Diode Types and Applications

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

Explanation for Marking

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

How to Create Symbols for PSpice Models

Models

ESD Data

Characteristics Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification