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CDIP (J)
Integrated Circuits (ICs)

JM38510/50604BRA

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Texas Instruments

HIGH-PERFORMANCE IMPACTPALCIRCUITS

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CDIP (J)
Integrated Circuits (ICs)

JM38510/50604BRA

Active
Texas Instruments

HIGH-PERFORMANCE IMPACTPALCIRCUITS

Technical Specifications

Parameters and characteristics for this part

SpecificationJM38510/50604BRA
Mounting TypeThrough Hole
Number of Macrocells4
Package / Case20-CDIP
Programmable TypePAL
Speed20 ns
Supplier Device Package20-CDIP
Voltage - Input [Max]5.5 V
Voltage - Input [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 3$ 111.81
Texas InstrumentsTUBE 1$ 118.40
100$ 114.84
250$ 95.61
1000$ 89.02

Description

General part information

TIBPAL16R4-20M Series

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTMcircuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTMcircuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.