Connectors, Interconnects
211-1-08-003
ActiveCnC Tech, LLC
CONN IC DIP SOCKET 8POS GOLD
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Connectors, Interconnects
211-1-08-003
ActiveCnC Tech, LLC
CONN IC DIP SOCKET 8POS GOLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 211-1-08-003 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Contact Resistance | 4 mOhm |
| Current Rating (Amps) | 3 A |
| Features | Open Frame |
| Housing Material | Polybutylene Terephthalate (PBT) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 8 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 0.3 " |
| Type | 7.62 mm |
| Type | DIP |
211-1 Series
| Part | Termination | Housing Material | Pitch - Post | Pitch - Post | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Features | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Contact Material - Mating | Mounting Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Contact Material - Post [custom] | Contact Finish - Mating | Contact Resistance | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 CnC Tech, LLC | Solder | Polybutylene Terephthalate (PBT) | 2.54 mm | 0.1 in | UL94 V-0 | 105 ░C | -55 °C | Open Frame | Tin | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Beryllium Copper | Through Hole | 2 | 6 | 3 | 0.3 " | 7.62 mm | DIP | 200 µin | 5.08 µm | 3 A | Brass | Gold | 4 mOhm | 0.1 in | 2.54 mm | |||
 CnC Tech, LLC | Solder | Polybutylene Terephthalate (PBT) | 2.54 mm | 0.1 in | UL94 V-0 | 105 ░C | -55 °C | Open Frame | Tin | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Beryllium Copper | Through Hole | 0.3 " | 7.62 mm | DIP | 200 µin | 5.08 µm | 3 A | Brass | Gold | 4 mOhm | 0.1 in | 2.54 mm | 20 | |||||
 CnC Tech, LLC | Solder | Polybutylene Terephthalate (PBT) | 2.54 mm | 0.1 in | UL94 V-0 | 105 ░C | -55 °C | Open Frame | Tin | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Beryllium Copper | Through Hole | 0.6 in | 15.24 mm | DIP | 200 µin | 5.08 µm | 3 A | Brass | Gold | 4 mOhm | 0.1 in | 2.54 mm | 2 x 16 | 32 | ||||
 CnC Tech, LLC | Solder | Polybutylene Terephthalate (PBT) | 2.54 mm | 0.1 in | UL94 V-0 | 105 ░C | -55 °C | Open Frame | Tin | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Beryllium Copper | Through Hole | 0.3 " | 7.62 mm | DIP | 200 µin | 5.08 µm | 3 A | Brass | Gold | 4 mOhm | 0.1 in | 2.54 mm | 18 | |||||
CnC Tech, LLC | Solder | Polybutylene Terephthalate (PBT) | 2.54 mm | 0.1 in | UL94 V-0 | 105 ░C | -55 °C | Open Frame | Tin | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Beryllium Copper | Through Hole | 0.3 " | 7.62 mm | DIP | 200 µin | 5.08 µm | 3 A | Brass | Gold | 4 mOhm | 0.1 in | 2.54 mm | 8 | |||||
 CnC Tech, LLC | Solder | Polybutylene Terephthalate (PBT) | 2.54 mm | 0.1 in | UL94 V-0 | 105 ░C | -55 °C | Open Frame | Tin | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Beryllium Copper | Through Hole | 0.3 " | 7.62 mm | DIP | 200 µin | 5.08 µm | 3 A | Brass | Gold | 4 mOhm | 0.1 in | 2.54 mm | 14 | |||||
 CnC Tech, LLC | Solder | Polybutylene Terephthalate (PBT) | 2.54 mm | 0.1 in | UL94 V-0 | 105 ░C | -55 °C | Open Frame | Tin | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Beryllium Copper | Through Hole | 2 | 20 | 0.6 in | 15.24 mm | DIP | 200 µin | 5.08 µm | 3 A | Brass | Gold | 4 mOhm | 0.1 in | 2.54 mm | 40 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 0.85 | |
| 10 | $ 0.72 | |||
| 25 | $ 0.69 | |||
| 50 | $ 0.67 | |||
| 100 | $ 0.64 | |||
| 250 | $ 0.59 | |||
| 500 | $ 0.53 | |||
| 1000 | $ 0.47 | |||
| 2500 | $ 0.42 | |||
Description
General part information
211-1 Series
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources