Zenode.ai Logo
Beta
PowerPAK-MLP55-31L
Integrated Circuits (ICs)

SIC638ACD-T1-GE3

Active

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet
PowerPAK-MLP55-31L
Integrated Circuits (ICs)

SIC638ACD-T1-GE3

Active

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationSIC638ACD-T1-GE3
ApplicationsSynchronous Buck Converters
Current - Output / Channel50 A
Fault ProtectionShoot-Through, UVLO
FeaturesStatus Flag, Diode Emulation, Bootstrap Circuit
InterfacePWM
Load TypeCapacitive, Inductive
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Output ConfigurationHalf Bridge (2)
Package / CasePowerPAK® MLP55-31L
Supplier Device PackagePowerPAK® MLP55-31L
TechnologyPower MOSFET
Voltage - Load [Max]5.5 V
Voltage - Load [Min]4.5 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.69
10$ 2.42
25$ 2.28
100$ 1.94
250$ 1.82
500$ 1.60
1000$ 1.32
Digi-Reel® 1$ 2.69
10$ 2.42
25$ 2.28
100$ 1.94
250$ 1.82
500$ 1.60
1000$ 1.32
Tape & Reel (TR) 3000$ 1.13

Description

General part information

SIC638 Series

Half Bridge (2) Driver Synchronous Buck Converters Power MOSFET PowerPAK® MLP55-31L

Documents

Technical documentation and resources