OM13491UL
UnknownBREAKOUT BOARD, 8-HWSON X 2, 8-MSOP X 2, 8-VSSOP, 8-XQFN, 8-SOIC/DIP, 0.1" PITCH SPACING
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OM13491UL
UnknownBREAKOUT BOARD, 8-HWSON X 2, 8-MSOP X 2, 8-VSSOP, 8-XQFN, 8-SOIC/DIP, 0.1" PITCH SPACING
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | OM13491UL |
|---|---|
| Kit Type | Adapter, Breakout Boards |
| Number of Positions | 8 |
| Package Accepted | SO, HWSON, XQFN, VSSOP, MSOP |
| Quantity | 42 |
| Quantity Details | 5 Values, Mixed Quantities |
| Specifications | SMD to DIP |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Newark | Each | 1 | $ 20.68 | 1m+ |
CAD
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Description
General part information
OM13491 Series
OM13491UL is a surface mount to DIP evaluation board. The OM13491 allows one to evaluate small, surface mount devices by breaking out the package leads to 100mil centers pins, emulating a DIP package. The OM13491 supports the following packages such as SO8 (SOT96), VSSOP8 (SOT765), XQFN8 (SOT902), HWSON8 x 2 (SOT1069), MSOP8 x 2 (SOT505).
Documents
Technical documentation and resources