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UMD3
Discrete Semiconductor Products

DAP236UT106

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Rohm Semiconductor

RF DIODE STANDARD 35V 150MW UMD3

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UMD3
Discrete Semiconductor Products

DAP236UT106

Active
Rohm Semiconductor

RF DIODE STANDARD 35V 150MW UMD3

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationDAP236UT106
Capacitance @ Vr, F1.2 pF
Diode TypeStandard - 1 Pair Common Anode
Operating Temperature125 ¯C
Package / CaseSOT-323, SC-70
Power Dissipation (Max) [Max]150 mW
Resistance @ If, F900 mOhm
Supplier Device PackageUMD3
Voltage - Peak Reverse (Max) [Max]35 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.62
10$ 0.38
25$ 0.32
100$ 0.24
250$ 0.21
500$ 0.19
1000$ 0.17
Digi-Reel® 1$ 0.62
10$ 0.38
25$ 0.32
100$ 0.24
250$ 0.21
500$ 0.19
1000$ 0.17
N/A 9582$ 0.28
Tape & Reel (TR) 3000$ 0.14
6000$ 0.13
9000$ 0.13
15000$ 0.12
21000$ 0.12
30000$ 0.11
75000$ 0.10

Description

General part information

DAP236 Series

RF Diode Standard - 1 Pair Common Anode 35V 150 mW UMD3

Documents

Technical documentation and resources

UMD3 Part Marking

Related Document

Diode Flammability

Related Document

UMD3 T106 Taping Spec

Datasheet

About Export Regulations

Export Information

DAP236U Data Sheet

Data Sheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Constitution Materials List

Environmental Data

Inner Structure

Package Information

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Reliability Test Result

Manufacturing Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Create Symbols for PSpice Models

Models

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Package Dimensions

Package Information

Diode Types and Applications

Technical Article

ESD Data

Characteristics Data

What is a Thermal Model? (Diode)

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design