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Discrete Semiconductor Products

UMG4NTR

Active
Rohm Semiconductor

NPN+NPN, SOT-353, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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Product thumbnail image
Discrete Semiconductor Products

UMG4NTR

Active
Rohm Semiconductor

NPN+NPN, SOT-353, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationUMG4NTR
Current - Collector (Ic) (Max) [Max]100 mA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / CaseSOT-353, SC-70-5, 5-TSSOP
Supplier Device PackageUMT5
Transistor Type2 NPN - Pre-Biased (Dual)
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.46
10$ 0.33
100$ 0.16
500$ 0.15
1000$ 0.11
Digi-Reel® 1$ 0.46
10$ 0.33
100$ 0.16
500$ 0.15
1000$ 0.11
Tape & Reel (TR) 3000$ 0.07
6000$ 0.07

Description

General part information

UMG4N Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Create Symbols for PSpice Models

Models

Inner Structure

Package Information

Part Explanation

Application Note

ESD Data

Characteristics Data

What Is Thermal Design

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Explanation for Marking

Package Information

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

About Export Regulations

Export Information

Constitution Materials List

Environmental Data

About Flammability of Materials

Environmental Data

UMG4N Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design