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Technical Specifications
Parameters and characteristics for this part
| Specification | MMIX4G20N250 |
|---|---|
| Configuration | Full Bridge |
| Current - Collector (Ic) (Max) [Max] | 23 A |
| Current - Collector Cutoff (Max) [Max] | 10 µA |
| Input | Standard |
| Input Capacitance (Cies) @ Vce | 1.19 nF |
| Mounting Type | Surface Mount |
| NTC Thermistor | False |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 24-SMD Module, 9 Leads |
| Power - Max [Max] | 100 W |
| Supplier Device Package | 24-SMPD |
| Vce(on) (Max) @ Vge, Ic | 3.1 V |
| Voltage - Collector Emitter Breakdown (Max) [Max] | 2500 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
MMIX4G20N250 Series
Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines.