Zenode.ai Logo
Beta
Product dimension image
Discrete Semiconductor Products

YQ5RSM10SDTFTL1

Active
Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 5A, TO-277GE, HIGHLY EFFICIENT SBD FOR AUTOMOTIVE

Deep-Dive with AI

Search across all available documentation for this part.

Product dimension image
Discrete Semiconductor Products

YQ5RSM10SDTFTL1

Active
Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 5A, TO-277GE, HIGHLY EFFICIENT SBD FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationYQ5RSM10SDTFTL1
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr25 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseTO-277, 3-PowerDFN
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackageTO-277A
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If [Max]770 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3960$ 1.37
NewarkEach (Supplied on Cut Tape) 1$ 1.56
10$ 0.90
25$ 0.80
50$ 0.71
100$ 0.61
250$ 0.58
500$ 0.55
1000$ 0.50

Description

General part information

YQ5RSM10SDTF Series

The YQ5RSM10SDTF is a highly efficient Schottky Barrier Diode that is designed improving the tradeoff between low VFand low IR. While its low VFit achieves stable operation at high temperatures. Ideal for switching power supplies, freewheel diodes, and reverse polarity protection applications.

Documents

Technical documentation and resources

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

YQ5RSM10SDTF Data Sheet

Data Sheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Diode Types and Applications

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

How to Select Rectifier Diodes

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Anti-Whisker formation - Diodes

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

TO-277GE Dimensions

Package Information