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Discrete Semiconductor Products

RGE80TS65DGC13

NRND
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, FRD BUILT-IN, TO-247GE, FIELD STOP TRENCH IGBT

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Product thumbnail image
Discrete Semiconductor Products

RGE80TS65DGC13

NRND
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 40A, FRD BUILT-IN, TO-247GE, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGE80TS65DGC13
Current - Collector (Ic) (Max) [Max]63 A
Current - Collector Pulsed (Icm)120 A
Gate Charge85 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]200 W
Reverse Recovery Time (trr)183 ns
Supplier Device PackageTO-247GE
Switching Energy780 µJ, 1.09 mJ
Td (on/off) @ 25°C [custom]49 ns
Td (on/off) @ 25°C [custom]131 ns
Test Condition400 V, 10 Ohm, 15 V, 40 A
Vce(on) (Max) @ Vge, Ic2.05 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 595$ 7.41
NewarkEach 1$ 6.60
10$ 5.24
25$ 4.68
50$ 4.39
100$ 4.09
250$ 3.72
500$ 3.54

Description

General part information

RGE80TS65DG Series

RGE80TS65DG is IGBT featuring low switching loss and low conduction loss. It is ideal for Power Conditioner and Welder and General Inverter and UPS

Documents

Technical documentation and resources

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Anti-Whisker formation

Package Information

What is a Thermal Model? (IGBT)

Thermal Design

About Flammability of Materials

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

RGE80TS65DG Data Sheet

Data Sheet

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Compliance of the ELV directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level

Package Information

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Package Dimensions - TO-247GE

Package Information

PCB Layout Thermal Design Guide

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification