Soldering, Desoldering, Rework Products

SMD4300LTLFP250T4

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SOLDER PASTE SN42/BI57.6/AG0.4

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Soldering, Desoldering, Rework Products

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SOLDER PASTE SN42/BI57.6/AG0.4

Technical Specifications

Parameters and characteristics for this part

Specification	SMD4300LTLFP250T4

Composition	57.6 %, 42 %, 0.4 %
Flux Type	No-Clean, Water Soluble
Form	8.8 oz
Form	Jar
Form	250 g
Melting Point	280 °F
Melting Point	138 °C
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature [Max]	77 °F
Storage/Refrigeration Temperature [Max]	77 °F
Storage/Refrigeration Temperature [Min]	32 °F
Storage/Refrigeration Temperature [Min]	0 °C
Type	Solder Paste

Part	Shipping Info	Process	Form	Form	Form	Flux Type	Type	Mesh Type	Shelf Life Start	Melting Point	Shelf Life	Shelf Life	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Composition	Melting Point
Chip Quik Inc. SMD4300AX500T4C	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Leaded	17.64 oz	500 g	Cartridge	No-Clean Water Soluble	Solder Paste	4	Date of Manufacture	361 °F	12 Months
Chip Quik Inc. SMD4300LTLFP250T4			8.8 oz	250 g	Jar	No-Clean Water Soluble	Solder Paste		Date of Manufacture	280 °F		6 Months	32 °F	77 °F	0 °C	77 °F	0.4 % 42 % 57.6 %	138 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Lead Free No-Clean, Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

Technical documentation and resources

No documents available