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SC-70-6
Integrated Circuits (ICs)

BUF05704AIPWPR

NRND
Texas Instruments

18-V SUPPLY MULTI-CHANNEL GAMMA CORRECTION BUFFER

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SC-70-6
Integrated Circuits (ICs)

BUF05704AIPWPR

NRND
Texas Instruments

18-V SUPPLY MULTI-CHANNEL GAMMA CORRECTION BUFFER

Technical Specifications

Parameters and characteristics for this part

SpecificationBUF05704AIPWPR
-3db Bandwidth1 MHz
Current - Supply5 mA
Mounting TypeSurface Mount
Number of Circuits4
Output TypeRail-to-Rail
Package / Case14-PowerTSSOP
Package / Case [x]0.173 in
Package / Case [y]4.4 mm
Slew Rate1.6 V/µs
Supplier Device Package14-HTSSOP
Voltage - Supply, Single/Dual (±) [Max]18 V
Voltage - Supply, Single/Dual (±) [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.55
10$ 1.39
25$ 1.32
100$ 1.08
250$ 1.01
500$ 0.89
1000$ 0.71
Digi-Reel® 1$ 1.55
10$ 1.39
25$ 1.32
100$ 1.08
250$ 1.01
500$ 0.89
1000$ 0.71
Tape & Reel (TR) 2000$ 0.58
Texas InstrumentsLARGE T&R 1$ 1.32
100$ 1.02
250$ 0.75
1000$ 0.54

Description

General part information

BUF05704 Series

The BUFxx704 are a series of multi-channel buffers targeted towards gamma correction in high-resolution LCD panels. They are pin-compatible with the existing BUFxx702 and BUFxx703 families and operate at higher supply voltages up to 18 V (19 V absolute max). The higher supply voltage enables faster response times and brighter images in large-screen LCD panels. This is especially important in LCD TV applications.

The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, 10, 6, and 4 channel options are offered. For additional space and cost savings, a VCOM channel with > 100mA drive capability is integrated into the BUF11704, BUF07704, and BUF05704.

The BUF11704, BUF07704, BUF06704, and BUF05704 are available in the TSSOP-28, TSSOP-20, TSSOP-16, and TSSOP-14 PowerPAD packages for dramatically increased power dissipation capability. This way, a large number of channels can be handled safely in one package.