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ROHM RQ6E030ATTCR
Discrete Semiconductor Products

RQ6E050AJTCR

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Rohm Semiconductor

NCH 30V 5A MIDDLE POWER MOSFET

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ROHM RQ6E030ATTCR
Discrete Semiconductor Products

RQ6E050AJTCR

Active
Rohm Semiconductor

NCH 30V 5A MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ6E050AJTCR
Current - Continuous Drain (Id) @ 25°C5 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]2.5 V
Drive Voltage (Max Rds On, Min Rds On) [Min]4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs4.7 nC
Input Capacitance (Ciss) (Max) @ Vds520 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-6 Thin, TSOT-23-6
Power Dissipation (Max)950 mW
Rds On (Max) @ Id, Vgs35 mOhm
Supplier Device PackageTSMT6 (SC-95)
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1591$ 0.94
NewarkEach (Supplied on Cut Tape) 1$ 0.83
10$ 0.57
25$ 0.51
50$ 0.45
100$ 0.39
250$ 0.34
500$ 0.30
1000$ 0.27

Description

General part information

RQ6E050AJ Series

RQ6E050AJ is small surface mount package MOSFET which is suitable for switching application.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

How to Create Symbols for PSpice Models

Models

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Anti-Whisker formation - Transistors

Package Information

RQ6E050AJ ESD Data

Characteristics Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Inner Structure

Package Information

About Export Regulations

Export Information

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

TSMT6_TCR Taping Information

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Package Dimensions

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data