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UMD6
Discrete Semiconductor Products

RB731XNFHTR

Active
Rohm Semiconductor

40V, 30MA, SOT-363, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

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Search across all available documentation for this part.

UMD6
Discrete Semiconductor Products

RB731XNFHTR

Active
Rohm Semiconductor

40V, 30MA, SOT-363, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRB731XNFHTR
Current - Average Rectified (Io) (per Diode)30 mA
Current - Reverse Leakage @ Vr1 µA
Diode Configuration3 Independent
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / Case6-TSSOP, SC-88, SOT-363
QualificationAEC-Q101
SpeedAny Speed
Speed200 mA
Supplier Device PackageUMD6
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V
Voltage - Forward (Vf) (Max) @ If370 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.78
10$ 0.49
100$ 0.31
500$ 0.24
1000$ 0.22
Digi-Reel® 1$ 0.78
10$ 0.49
100$ 0.31
500$ 0.24
1000$ 0.22
Tape & Reel (TR) 3000$ 0.18
6000$ 0.17
9000$ 0.16
15000$ 0.15
21000$ 0.15
30000$ 0.14
NewarkEach (Supplied on Cut Tape) 1$ 0.75
10$ 0.46
25$ 0.41
50$ 0.37
100$ 0.32
250$ 0.28
500$ 0.24
1000$ 0.22

Description

General part information

RB731XNFH Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.

Documents

Technical documentation and resources

UMD6 Part Marking

Related Document

Diode Flammability

Related Document

AEC-Q101 Automotive Requirements

Related Document

UMD6 TR Taping Spec

Datasheet

Technical Data Sheet EN

Datasheet

Moisture Sensitivity Level - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Create Symbols for PSpice Models

Models

Power Loss and Thermal Design of Diodes

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

RB731XNFH Data Sheet

Data Sheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Regulations

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Diode Types and Applications

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design