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Discrete Semiconductor Products

UMD9NFHATR

Active
Rohm Semiconductor

NPN+PNP, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR) FOR AUTOMOTIVE

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Product schematic image
Discrete Semiconductor Products

UMD9NFHATR

Active
Rohm Semiconductor

NPN+PNP, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR) FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationUMD9NFHATR
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]68
Frequency - Transition250 MHz
GradeAutomotive
Mounting TypeSurface Mount
Package / CaseSOT-363, SC-88, 6-TSSOP
QualificationAEC-Q101
Resistor - Emitter Base (R2)47 kOhms
Supplier Device PackageUMT6
Transistor Type1 NPN, 1 PNP - Pre-Biased (Dual)
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.48
10$ 0.30
100$ 0.19
500$ 0.14
1000$ 0.13
Digi-Reel® 1$ 0.48
10$ 0.30
100$ 0.19
500$ 0.14
1000$ 0.13
Tape & Reel (TR) 3000$ 0.11
6000$ 0.10
9000$ 0.09
15000$ 0.09
21000$ 0.08
30000$ 0.08
75000$ 0.07
NewarkEach (Supplied on Cut Tape) 1$ 0.43
10$ 0.27
25$ 0.23
50$ 0.20
100$ 0.16
250$ 0.15
500$ 0.14
1000$ 0.13
TMEN/A 1$ 0.17
10$ 0.11
50$ 0.09
100$ 0.08
500$ 0.07

Description

General part information

UMD9NFHA Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

What is a Thermal Model? (Transistor)

Thermal Design

Reliability Test Result

Manufacturing Data

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Taping Information

Package Information

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Explanation for Marking

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Part Explanation

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

ESD Data

Characteristics Data

UMD9NFHA Data Sheet

Data Sheet

Moisture Sensitivity Level - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Regulations

Export Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification