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16-SSOPB
Integrated Circuits (ICs)

BD18337EFV-ME2

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Rohm Semiconductor

FOR AUTOMOTIVE, 40V 150MA 4CH CONSTANT CURRENT LED DRIVER

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16-SSOPB
Integrated Circuits (ICs)

BD18337EFV-ME2

Active
Rohm Semiconductor

FOR AUTOMOTIVE, 40V 150MA 4CH CONSTANT CURRENT LED DRIVER

Technical Specifications

Parameters and characteristics for this part

SpecificationBD18337EFV-ME2
ApplicationsLighting
Current - Output / Channel150 mA
DimmingPWM
Frequency750 Hz
GradeAutomotive
Internal Switch(s)True
Mounting TypeSurface Mount
Number of Outputs4
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case16-VSSOP (0.173", 4.40mm Width) Exposed Pad
QualificationAEC-Q100
Supplier Device PackageHTSSOP-B16
TypePower Switch
Voltage - Supply (Max) [Max]20 V
Voltage - Supply (Min) [Min]5.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.36
10$ 3.59
25$ 3.13
100$ 2.61
250$ 2.36
500$ 2.21
1000$ 2.08
Digi-Reel® 1$ 5.36
10$ 3.59
25$ 3.13
100$ 2.61
250$ 2.36
500$ 2.21
1000$ 2.08
N/A 2000$ 3.81
Tape & Reel (TR) 2500$ 1.95
5000$ 1.89

Description

General part information

BD18337 Series

BD18337EFV-M are 40V-withstanding constant current LED driver for automotive applications. It is a 4 channel LED driver with the built-in energy sharing control which can realize to make the board size small. High reliability can be realized with LED Open Detection, the OUTx (all later x=1 to 4) pin Short Circuit Protection, Over Voltage Mute and Thermal Shutdown Function. In case the output OUTx pin has 3 LEDs in series, this BD18337EFV-M has to be used, in case of 2 LEDs in series, BD18347EFV-M has to be used.

Documents

Technical documentation and resources

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

ROHM Automotive Lighting Solutions

White Paper

What Is Thermal Design

Thermal Design

How to Use the Two-Resistor Model

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Simulation Guide for BD183x7EFV / Thermal Simulation (ROHM Solution Simulator)

Simulations

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

BD18337EFV-M Spice Modeling Report

Models

BD18337EFV-M Data Sheet

Data Sheet

Impact of PWM Dimming on the Conducted EMI

Technical Article

BD18337EFV/BD18347EFV Simulation Guide (ROHM Solution Simulator)

Simulations

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Two-Resistor Thermal Model Report for BD18337EFV-M

Models

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

Thermal Resistance

Thermal Design

HTSSOP-B16 Package Information

Package Information

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Factory Information

Manufacturing Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design