Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines.