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Discrete Semiconductor Products

EMX52T2R

Active
Rohm Semiconductor

BIPOLAR ARRAY, DUAL NPN, 50V/0.1A/SOT563 ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

EMX52T2R

Active
Rohm Semiconductor

BIPOLAR ARRAY, DUAL NPN, 50V/0.1A/SOT563 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationEMX52T2R
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition350 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-563, SOT-666
Supplier Device PackageEMT6
Transistor Type2 NPN (Dual)
Vce Saturation (Max) @ Ib, Ic0.3 V
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.46
10$ 0.32
100$ 0.16
500$ 0.13
1000$ 0.10
2000$ 0.08
Digi-Reel® 1$ 0.46
10$ 0.32
100$ 0.16
500$ 0.13
1000$ 0.10
2000$ 0.08
N/A 19938$ 0.38
Tape & Reel (TR) 8000$ 0.08
16000$ 0.07
24000$ 0.07
56000$ 0.06
NewarkEach 1$ 0.40
10$ 0.24
100$ 0.15
500$ 0.11
1000$ 0.10
2500$ 0.09

Description

General part information

EMX52 Series

Bipolar (BJT) Transistor Array 2 NPN (Dual) 50V 100mA 350MHz 150mW Surface Mount EMT6

Documents

Technical documentation and resources

How to Create Symbols for PSpice Models

Models

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Types and Features of Transistors

Application Note

Moisture Sensitivity Level - Transistors

Package Information

EMX52 Data Sheet

Data Sheet

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

Part Explanation

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

ESD Data

Characteristics Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Constitution Materials List

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Taping Information

Package Information

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Inner Structure

Package Information

Package Dimensions

Package Information