Zenode.ai Logo
Beta
No image
Integrated Circuits (ICs)

SN65LVDS117DGG

Active
Texas Instruments

IC MULTIPLEXER 1CH 64TSSOP

Deep-Dive with AI

Search across all available documentation for this part.

Integrated Circuits (ICs)

SN65LVDS117DGG

Active
Texas Instruments

IC MULTIPLEXER 1CH 64TSSOP

Technical Specifications

Parameters and characteristics for this part

SpecificationSN65LVDS117DGG
Capacitance - Input5 pF
Current - Supply85 mA
Data Rate (Max)400 Mbps
Delay Time2.8 ns
InputLVDS
Mounting TypeSurface Mount
Number of Channels [custom]2:16
Number of Channels [custom]1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
OutputLVDS
Package / Case6.1 mm
Package / Case64-TFSOP
Package / Case [x]0.24 in
Supplier Device Package64-TSSOP
TypeMultiplexer, Buffer
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 100$ 9.24
Texas InstrumentsTUBE 1$ 10.33
100$ 8.42
250$ 6.62
1000$ 5.61

Description

General part information

SN65LVDS117 Series

The SN65LVDS109 and SN65LVDS117 are configured as two identical banks, each bank having one differential line receiver connected to either four ('109) or eight ('117) differential line drivers. The outputs are arranged in pairs having one output from each of the two banks. Individual output enables are provided for each pair of outputs and an additional enable is provided for all outputs.

The line receivers and line drivers implement the electrical characteristics of low-voltage differential signaling (LVDS). LVDS, as specified in EIA/TIA-644, is a data signaling technique that offers low power, low noise emission, high noise immunity, and high switching speeds. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)

The intended application of these devices, and the LVDS signaling technique, is for point-to-point or point-to-multipoint (distributed simplex) baseband data transmission on controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of drivers integrated into the same silicon substrate, along with the low pulse skew of balanced signaling, provides extremely precise timing alignment of the signals being repeated from the inputs. This is particularly advantageous for implementing system clock and data distribution trees.