SN74AUP3G17DQER
Active3-CH, 0.8-V TO 3.6-V LOW POWER BUFFERS WITH SCHMITT-TRIGGER INPUTS
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SN74AUP3G17DQER
Active3-CH, 0.8-V TO 3.6-V LOW POWER BUFFERS WITH SCHMITT-TRIGGER INPUTS
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP3G17DQER |
|---|---|
| Current - Output High, Low [custom] | 4 mA |
| Current - Output High, Low [custom] | 4 mA |
| Input Type | Schmitt Trigger |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Push-Pull |
| Package / Case | 8-XFDFN |
| Supplier Device Package | 8-X2SON (1.4x1) |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.63 | |
| 10 | $ 0.56 | |||
| 25 | $ 0.52 | |||
| 100 | $ 0.43 | |||
| 250 | $ 0.40 | |||
| 500 | $ 0.34 | |||
| 1000 | $ 0.27 | |||
| 2500 | $ 0.24 | |||
| Digi-Reel® | 1 | $ 0.63 | ||
| 10 | $ 0.56 | |||
| 25 | $ 0.52 | |||
| 100 | $ 0.43 | |||
| 250 | $ 0.40 | |||
| 500 | $ 0.34 | |||
| 1000 | $ 0.27 | |||
| 2500 | $ 0.24 | |||
| Tape & Reel (TR) | 5000 | $ 0.23 | ||
| 10000 | $ 0.22 | |||
| 25000 | $ 0.21 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.38 | |
| 100 | $ 0.26 | |||
| 250 | $ 0.20 | |||
| 1000 | $ 0.13 | |||
Description
General part information
SN74AUP3G17 Series
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.
The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources
