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BUF634ADEVM

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Texas Instruments

BUF634AD HIGH SPEED BUFFER EVALUATION MODULE

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Development Boards, Kits, Programmers

BUF634ADEVM

Active

Texas Instruments

BUF634AD HIGH SPEED BUFFER EVALUATION MODULE

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	BUF634ADEVM

-3db Bandwidth	210 MHz
Amplifier Type	Buffer
Board Type	Fully Populated
Channels per IC	1 - Single
Current - Output / Channel	64 mA
Current - Supply (Main IC)	3.7 mA
Output Type	Single-Ended
Slew Rate	3750 V/µs
Supplied Contents	Board(s)
Utilized IC / Part	BUF634A
Voltage - Supply, Single/Dual (±) [Max]	27 V, 13.5 V
Voltage - Supply, Single/Dual (±) [Min]	4.75 V, -2.4 V

BUF634A Series

210-MHz, 250-mA high-speed buffer

Part	Number of Circuits	Amplifier Type	Voltage - Supply Span (Max) [Max]	Current - Input Bias	-3db Bandwidth	Voltage - Supply Span (Min) [Min]	Current - Supply	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Slew Rate	Current - Output / Channel	Voltage - Input Offset	Mounting Type	Package / Case	Package / Case	Package / Case	Package / Case [y]	Package / Case [x]	Output Type	Supplied Contents	Utilized IC / Part	Current - Supply (Main IC)	Voltage - Supply, Single/Dual (±) [Min]	Voltage - Supply, Single/Dual (±) [Max]	Channels per IC	Board Type
Texas Instruments BUF634PG4	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	8-PDIP	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Through Hole	0.3 in	8-DIP	7.62 mm
Texas Instruments BUF634U	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	8-SOIC	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Surface Mount		8-SOIC		3.9 mm	0.154 in
Texas Instruments BUF634F	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	TO-263 (DDPAK-5)	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Surface Mount		D2PAK (5 Leads + Tab) TO-263-6 TO-263BA
Texas Instruments BUF634U/2K5	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	8-SOIC	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Surface Mount		8-SOIC		3.9 mm	0.154 in
Texas Instruments BUF634AIDR	1	General Purpose	36 V	30 nA	210 MHz	4.5 V	8.5 mA	8-SOIC	125 °C	-40 °C	3750 V/µs	250 mA	36 mV	Surface Mount		8-SOIC		3.9 mm	0.154 in	Push-Pull
Texas Instruments BUF634F/500E3	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	TO-263 (DDPAK-5)	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Surface Mount		D2PAK (5 Leads + Tab) TO-263-6 TO-263BA
Texas Instruments BUF634FKTTT	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	TO-263 (DDPAK-5)	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Surface Mount		D2PAK (5 Leads + Tab) TO-263-6 TO-263BA
Texas Instruments BUF634T	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	TO-220-5	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Through Hole		TO-220-5
Texas Instruments BUF634ADEVM		Buffer			210 MHz						3750 V/µs	64 mA								Single-Ended	Board(s)	BUF634A	3.7 mA	-2.4 V 4.75 V	13.5 V 27 V	1 - Single	Fully Populated
Texas Instruments BUF634F/500	1	Buffer	36 V	5 µA	180 MHz	4.5 V	15 mA	TO-263 (DDPAK-5)	85 °C	-40 °C	2000 V/µs	250 mA	30 mV	Surface Mount		D2PAK (5 Leads + Tab) TO-263-6 TO-263BA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	1	$ 118.80

Description

General part information

BUF634A Series

The BUF634A device is a high-performance, high-fidelity, open-loop buffer that is capable of driving 250 mA of output current. The BUF634A is a 36-V device with an adjustable bandwidth of 35 MHz to 210 MHz, which is accomplished by varying the value of an external resistor between the V– and BW pins.

The BUF634A device can be used as a standalone open-loop driver, or used inside the feedback loop of a precision op amp to provide both high-precision and large output current drive with improved capacitive load drive.

For low-power applications, the BUF634A device operates on a 1.5-mA quiescent current with a 250-mA output, 3750-V/µs slew rate, and 35-MHz bandwidth. The device consumes 8.5-mA quiescent current in wide-bandwidth mode with a 210-MHz bandwidth. The BUF634A is fully protected by an internal current limit in its output stage and by thermal shutdown, making the device rugged and easy to use.

Documents

Technical documentation and resources