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Discrete Semiconductor Products

R6507KND3TL1

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Rohm Semiconductor

HIGH-SPEED SWITCHING, NCH 650V 7A, TO-252 (DPAK), POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

R6507KND3TL1

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, NCH 650V 7A, TO-252 (DPAK), POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6507KND3TL1
Current - Continuous Drain (Id) @ 25°C7 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs14.5 nC
Input Capacitance (Ciss) (Max) @ Vds470 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Power Dissipation (Max)78 W
Rds On (Max) @ Id, Vgs665 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.46
10$ 1.58
100$ 1.08
500$ 0.87
1000$ 0.80
Digi-Reel® 1$ 2.46
10$ 1.58
100$ 1.08
500$ 0.87
1000$ 0.80
Tape & Reel (TR) 2500$ 0.69
NewarkEach (Supplied on Cut Tape) 1$ 2.49
10$ 1.64
25$ 1.47
50$ 1.30
100$ 1.12
250$ 1.01
500$ 0.90
1000$ 0.82

Description

General part information

R6507END3 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

R6507KND3 Data Sheet

Data Sheet

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

Explanation for Marking

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Types and Features of Transistors

Application Note

About Export Regulations

Export Information

R6507KND3 ESD Data

Characteristics Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Flammability of Materials

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data