Specification	R6507KND3TL1

Current - Continuous Drain (Id) @ 25°C	7 A
Drain to Source Voltage (Vdss)	650 V
Drive Voltage (Max Rds On, Min Rds On)	10 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]	14.5 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]	470 pF
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	TO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)	78 W
Rds On (Max) @ Id, Vgs	665 mOhm
Supplier Device Package	TO-252
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	5 V

R6507 Series

High-speed Switching, Nch 650V 7A, TO-252 (DPAK), Power MOSFET

Part	Vgs(th) (Max) @ Id	Current - Continuous Drain (Id) @ 25°C	Vgs (Max)	Rds On (Max) @ Id, Vgs	Supplier Device Package	Drain to Source Voltage (Vdss)	Drive Voltage (Max Rds On, Min Rds On)	Mounting Type	FET Type	Package / Case	Power Dissipation (Max)	Gate Charge (Qg) (Max) @ Vgs [Max]	Operating Temperature	Technology	Input Capacitance (Ciss) (Max) @ Vds [Max]	Input Capacitance (Ciss) (Max) @ Vds
Rohm Semiconductor R6507KND3TL1	5 V	7 A	20 V	665 mOhm	TO-252	650 V	10 V	Surface Mount	N-Channel	DPAK (2 Leads + Tab) SC-63 TO-252-3	78 W	14.5 nC	150 °C	MOSFET (Metal Oxide)	470 pF
Rohm Semiconductor R6507KNXC7G	5 V	7 A	20 V	665 mOhm	TO-220FM	650 V	10 V	Through Hole	N-Channel	TO-220-3 Full Pack	46 W	14.5 nC	150 °C	MOSFET (Metal Oxide)	470 pF
Rohm Semiconductor R6507END3TL1	4 V	7 A	20 V	665 mOhm	TO-252	650 V	10 V	Surface Mount	N-Channel	DPAK (2 Leads + Tab) SC-63 TO-252-3	78 W	20 nC	150 °C	MOSFET (Metal Oxide)		390 pF

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 2.46
		10	$ 1.58
		100	$ 1.08
		500	$ 0.87
		1000	$ 0.80
	Digi-Reel®	1	$ 2.46
		10	$ 1.58
		100	$ 1.08
		500	$ 0.87
		1000	$ 0.80
	N/A	2453	$ 2.45
	Tape & Reel (TR)	2500	$ 0.69
Newark	Each (Supplied on Cut Tape)	1	$ 2.49
		10	$ 1.64
		25	$ 1.47
		50	$ 1.30
		100	$ 1.12
		250	$ 1.01
		500	$ 0.90
		1000	$ 0.82

Description

General part information

R6507 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

R6507KND3TL1

Deep-Dive with AI

R6507KND3TL1

Deep-Dive with AI

Technical Specifications

R6507 Series

Pricing

Description

R6507 Series

Documents

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Part Explanation

Explanation for Marking

Basics of Thermal Resistance and Heat Dissipation

Two-Resistor Model for Thermal Simulation

Measurement Method and Usage of Thermal Resistance RthJC

Compliance of the RoHS directive

How to Use LTspice&reg; Models: Tips for Improving Convergence

Report of SVHC under REACH Regulation

Method for Monitoring Switching Waveform

Package Dimensions

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Anti-Whisker formation - Transistors

Types and Features of Transistors

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Moisture Sensitivity Level - Transistors

MOSFET Gate Resistor Setting for Motor Driving

TO-252_TL1 Taping Information

What Is Thermal Design

About Export Regulations

Reliability Test Result

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

List of Transistor Package Thermal Resistance

MOSFET Gate Drive Current Setting for Motor Driving

What is a Thermal Model? (Transistor)

Notes for Calculating Power Consumption:Static Operation

Temperature derating method for Safe Operating Area (SOA)

How to Use LTspice&reg; Models

R6507KND3 ESD Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Notes for Temperature Measurement Using Thermocouples

PCB Layout Thermal Design Guide

Judgment Criteria of Thermal Evaluation

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Impedance Characteristics of Bypass Capacitor

R6507KND3 Data Sheet

About Flammability of Materials

Condition of Soldering / Land Pattern Reference

Importance of Probe Calibration When Measuring Power: Deskew

Calculation of Power Dissipation in Switching Circuit

R6507 Series

How to Use LTspice® Models: Tips for Improving Convergence

How to Use LTspice® Models