Specification	NSR05T30P2T5G

Capacitance @ Vr, F	33 pF
Current - Average Rectified (Io)	500 mA
Current - Reverse Leakage @ Vr	85 µA
Mounting Type	Surface Mount
Operating Temperature - Junction [Max]	150 °C
Operating Temperature - Junction [Min]	-55 °C
Package / Case	SOD-923
Reverse Recovery Time (trr)	9 ns
Speed	200 mA, 500 ns
Supplier Device Package	SOD-923
Technology	Schottky
Voltage - DC Reverse (Vr) (Max) [Max]	30 V

NSR05T40XV2 Series

500 mA, 20 V, Schottky Barrier Diode

Part	Supplier Device Package	Operating Temperature - Junction [Max]	Operating Temperature - Junction [Min]	Voltage - Forward (Vf) (Max) @ If	Current - Reverse Leakage @ Vr	Reverse Recovery Time (trr)	Voltage - DC Reverse (Vr) (Max) [Max]	Package / Case	Capacitance @ Vr, F	Current - Average Rectified (Io)	Speed	Technology	Mounting Type	Operating Temperature - Junction
ON Semiconductor NSR05T40XV2T5G	SOD-523	150 °C	-55 °C	640 mV	55 µA	20 ns	40 V	SC-79 SOD-523	70 pF	500 mA	200 mA 500 ns	Schottky	Surface Mount
ON Semiconductor NSR05F40NXT5G	2-DSN (1x0.6) (0402)			460 mV	75 µA		40 V	0402 (1006 Metric)		500 mA	200 mA 500 ns	Schottky	Surface Mount	150 °C
ON Semiconductor NSR05T30P2T5G	SOD-923	150 °C	-55 °C		85 µA	9 ns	30 V	SOD-923	33 pF	500 mA	200 mA 500 ns	Schottky	Surface Mount
ON Semiconductor NSR05F20NXT5G	2-DSN (1x0.6) (0402)			430 mV	75 µA		20 V	0402 (1006 Metric)		500 mA	200 mA 500 ns	Schottky	Surface Mount	150 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.36
		10	$ 0.25
		100	$ 0.12
		500	$ 0.10
		1000	$ 0.07
		2000	$ 0.06
	Digi-Reel®	1	$ 0.36
		10	$ 0.25
		100	$ 0.12
		500	$ 0.10
		1000	$ 0.07
		2000	$ 0.06
	Tape & Reel (TR)	8000	$ 0.06
		16000	$ 0.05
		24000	$ 0.05
		56000	$ 0.04
		200000	$ 0.04

Description

General part information

NSR05T40XV2 Series

This 20 V, 500 mA Schottky Barrier Diode is optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package (CSP) to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.