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DocumentsAGFA023R31C2I1VB | Datasheet
Deep-Dive with AI
DocumentsAGFA023R31C2I1VB | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | AGFA023R31C2I1VB |
|---|---|
| Architecture | FPGA, MPU |
| Connectivity | UART/USART, MMC/SD/SDIO, EBI/EMI, I2C, SPI, Ethernet, USB OTG |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Number of I/O | 480 |
| Operating Temperature [Max] | 100 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 3184-BFBGA Exposed Pad |
| Peripherals | WDT, DMA |
| Primary Attributes | 2.3 M |
| RAM Size | 256 KB |
| Speed | 1.4 GHz |
| Supplier Device Package | 3184-BGA (56x45) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
AGFA023 Series
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 2.3M Logic Elements 1.4GHz 3184-BGA (56x45)
Documents
Technical documentation and resources