Zenode.ai Logo
Beta
8-SOIC
Isolators

MOC217R2VM

Active
ON Semiconductor

30V 2.5KV 150MA 400MV@100UA,1MA 1 6V 1.07V DC SOIC-8 TRANSISTOR, PHOTOVOLTAIC OUTPUT OPTOISOLATORS ROHS

Deep-Dive with AI

Search across all available documentation for this part.

8-SOIC
Isolators

MOC217R2VM

Active
ON Semiconductor

30V 2.5KV 150MA 400MV@100UA,1MA 1 6V 1.07V DC SOIC-8 TRANSISTOR, PHOTOVOLTAIC OUTPUT OPTOISOLATORS ROHS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationMOC217R2VM
Current - DC Forward (If) (Max) [Max]60 mA
Current - Output / Channel150 mA
Current Transfer Ratio (Min) [Min]100 %
Input TypeDC
Mounting TypeSurface Mount
Number of Channels1
Operating Temperature [Max]100 °C
Operating Temperature [Min]-40 °C
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Rise / Fall Time (Typ) [custom]3.2 µs
Rise / Fall Time (Typ) [custom]4.7 µs
Supplier Device Package8-SOIC
Turn On / Turn Off Time (Typ)7.5 µs, 5.7 µs
Vce Saturation (Max) [Max]400 mV
Voltage - Forward (Vf) (Typ)1.07 V
Voltage - Isolation2500 Vrms
Voltage - Output (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1217$ 0.25
1217$ 0.25
Cut Tape (CT) 1$ 0.77
1$ 0.77
10$ 0.50
10$ 0.50
100$ 0.33
100$ 0.33
1000$ 0.26
1000$ 0.26
Digi-Reel® 1$ 0.77
1$ 0.77
10$ 0.50
10$ 0.50
100$ 0.33
100$ 0.33
1000$ 0.26
1000$ 0.26
Tape & Reel (TR) 2500$ 0.24
2500$ 0.24
5000$ 0.23
5000$ 0.23
12500$ 0.23
12500$ 0.23
25000$ 0.22
25000$ 0.22
LCSCPiece 1$ 0.61
200$ 0.23
500$ 0.23
1000$ 0.22
NewarkEach (Supplied on Full Reel) 1$ 0.29
3000$ 0.29
6000$ 0.27
12000$ 0.25
18000$ 0.23
30000$ 0.22
ON SemiconductorN/A 1$ 0.23

Description

General part information

MOC217M Series

These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. They are ideally suited for high-density applications, and eliminate the need for through-the-board mounting.