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RF201LAM2STFTR
Discrete Semiconductor Products

RF201LAM2STFTR

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Rohm Semiconductor

AUTOMOTIVE FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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RF201LAM2STFTR
Discrete Semiconductor Products

RF201LAM2STFTR

Active
Rohm Semiconductor

AUTOMOTIVE FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

SpecificationRF201LAM2STFTR
Current - Average Rectified (Io)2 A
Current - Reverse Leakage @ Vr10 ÁA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-128
QualificationAEC-Q101
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If870 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2998$ 0.93
NewarkEach (Supplied on Full Reel) 3000$ 0.21
6000$ 0.20
12000$ 0.20
18000$ 0.20
30000$ 0.19

Description

General part information

RF201LAM2STF Series

RF201LAM2STF is the high reliability Automotive Fast Recovery Diode, suitable for general rectification.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

List of Diode Package Thermal Resistance

Thermal Design

RF201LAM2STF Data Sheet

Data Sheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Package Dimensions

Package Information

Diode Types and Applications

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

Explanation for Marking

Package Information

Reliability Test Result

Manufacturing Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data

ESD Data

Characteristics Data

Power Loss and Thermal Design of Diodes

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Report of SVHC under REACH Regulation

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Taping Information

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Inner Structure

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Product Change Notice EN

Datasheet