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| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
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| Part | Max Propagation Delay | Max CL | Number of Circuits | Package Width | Package Name | Package Length | Current - Quiescent (Max) | Input Logic Level - Low (Max) | Input Logic Level - Low (Min) | Mounting Type | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Current - Output High | Current - Output Low | Operating Temperature (Max) | Operating Temperature (Min) | Logic Type | Number of Inputs | Input Logic Level - High (Min) | Input Logic Level - High (Max) | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 NXP USA Inc. | 8 ns | 50 pF | 4 | 3.9 mm | 14-SO 14-SOIC | 0.154 in | 40 ĄA | 0.8 V | 0.3 V | Surface Mount | 1 V | 5.5 V | 12 mA | 12 mA | 125 °C | -40 °C | OR Gate | 2 | 0.9 V | 2 V | |
 NXP USA Inc. | 8 ns | 50 pF | 4 | 3.9 mm | 14-SO 14-SOIC | 0.154 in | 40 ĄA | 0.8 V | 0.3 V | Surface Mount | 1 V | 5.5 V | 12 mA | 12 mA | 125 °C | -40 °C | OR Gate | 2 | 0.9 V | 2 V | |
 NXP USA Inc. | 8 ns | 50 pF | 4 | 3 mm | 14-DHVQFN | 2.5 mm | 40 ĄA | 0.8 V | 0.3 V | Surface Mount | 1 V | 5.5 V | 12 mA | 12 mA | 125 °C | -40 °C | OR Gate | 2 | 0.9 V | 2 V | 14-VFQFN Exposed Pad |
NXP USA Inc. | |||||||||||||||||||||
 NXP USA Inc. | 8 ns | 50 pF | 4 | 5.3 mm | 14-SSOP | 0.209 in | 40 ĄA | 0.8 V | 0.3 V | Surface Mount | 1 V | 5.5 V | 12 mA | 12 mA | 125 °C | -40 °C | OR Gate | 2 | 0.9 V | 2 V | |
 NXP USA Inc. | 8 ns | 50 pF | 4 | 7.62 mm | 14-DIP | 0.3 in | 40 ĄA | 0.8 V | 0.3 V | Through Hole | 1 V | 5.5 V | 12 mA | 12 mA | 125 °C | -40 °C | OR Gate | 2 | 0.9 V | 2 V | |
 NXP USA Inc. | 8 ns | 50 pF | 4 | 4.4 mm | 14-TSSOP | 0.173 in | 40 ĄA | 0.8 V | 0.3 V | Surface Mount | 1 V | 5.5 V | 12 mA | 12 mA | 125 °C | -40 °C | OR Gate | 2 | 0.9 V | 2 V | |
 NXP USA Inc. | 8 ns | 50 pF | 4 | 4.4 mm | 14-TSSOP | 0.173 in | 40 ĄA | 0.8 V | 0.3 V | Surface Mount | 1 V | 5.5 V | 12 mA | 12 mA | 125 °C | -40 °C | OR Gate | 2 | 0.9 V | 2 V |