Zenode.ai Logo
Beta
ROHM Semiconductor-2SAR574D3TL1 GP BJT Trans GP BJT PNP 80V 2A 10000mW 3-Pin(2+Tab) DPAK T/R
Discrete Semiconductor Products

2SAR574D3TL1

Active
Rohm Semiconductor

TRANS GP BJT PNP 80V 2A 10000MW 3-PIN(2+TAB) DPAK T/R

Deep-Dive with AI

Search across all available documentation for this part.

ROHM Semiconductor-2SAR574D3TL1 GP BJT Trans GP BJT PNP 80V 2A 10000mW 3-Pin(2+Tab) DPAK T/R
Discrete Semiconductor Products

2SAR574D3TL1

Active
Rohm Semiconductor

TRANS GP BJT PNP 80V 2A 10000MW 3-PIN(2+TAB) DPAK T/R

Technical Specifications

Parameters and characteristics for this part

Specification2SAR574D3TL1
Current - Collector (Ic) (Max) [Max]2 A
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition280 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power - Max [Max]10 W
Supplier Device PackageTO-252
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3691$ 1.36
NewarkEach (Supplied on Cut Tape) 1$ 1.08
10$ 0.73
25$ 0.66
50$ 0.58
100$ 0.51
250$ 0.47
500$ 0.44
1000$ 0.38

Description

General part information

2SAR574D3 Series

2SAR574D3 is a power transistor with Low VCE(sat), suitable for low frequency amplifier.

Documents

Technical documentation and resources

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

TO-252_TL1 Taping Information

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Explanation for Marking

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

2SAR574D3 Thermal Resistance

Characteristics Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

2SAR574D3 ESD Data

Characteristics Data

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

2SAR574D3 Data Sheet

Data Sheet

List of Transistor Package Thermal Resistance

Thermal Design

Package Dimensions

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Part Explanation

Application Note

Types and Features of Transistors

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification