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Discrete Semiconductor Products

RB098BM-30FHHTL

Active
Rohm Semiconductor

SCHOTTKY RECTIFIER, 35V, 6A, TO-252 ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsCondition of Soldering / Land Pattern ReferenceWhat Is Thermal Design+28
Product thumbnail image
Discrete Semiconductor Products

RB098BM-30FHHTL

Active
Rohm Semiconductor

SCHOTTKY RECTIFIER, 35V, 6A, TO-252 ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsCondition of Soldering / Land Pattern ReferenceWhat Is Thermal Design+28

Technical Specifications

Parameters and characteristics for this part

SpecificationRB098BM-30FHHTL
Current - Average Rectified (Io) (per Diode)3 A
Current - Reverse Leakage @ Vr1.5 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
QualificationAEC-Q101
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If720 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.51
10$ 1.24
100$ 0.96
500$ 0.82
1000$ 0.66
Digi-Reel® 1$ 1.51
10$ 1.24
100$ 0.96
500$ 0.82
1000$ 0.66
Tape & Reel (TR) 2500$ 0.63
5000$ 0.60
12500$ 0.57
NewarkEach (Supplied on Cut Tape) 1$ 2.03
10$ 1.38
25$ 1.24
50$ 1.09
100$ 0.95
250$ 0.86
500$ 0.76
1000$ 0.70

Description

General part information

RB098BM-30FHH Series

RB098BM-30FHH is a ultra low IRschottky barrier diode, suitable for Switching power supply. It is a highly reliable product for automotive.

Documents

Technical documentation and resources

Condition of Soldering / Land Pattern Reference

Package Information

What Is Thermal Design

Thermal Design

Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Diode Types and Applications

Technical Article

Explanation for Marking

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

How to Select Rectifier Diodes

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Package Dimensions

Package Information

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data