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ROHM DTC023YUBTL
Discrete Semiconductor Products

DAN217WMTL

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 100MA, SERIES CONNECTION, SWITCHING DIODE

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Search across all available documentation for this part.

ROHM DTC023YUBTL
Discrete Semiconductor Products

DAN217WMTL

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 100MA, SERIES CONNECTION, SWITCHING DIODE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationDAN217WMTL
Current - Average Rectified (Io) (per Diode)100 mA
Current - Reverse Leakage @ Vr100 nA
Diode Configuration1 Pair Series Connection
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOT-490, SC-89
Reverse Recovery Time (trr)4 ns
Speed200 mA
SpeedAny Speed
Supplier Device PackageEMD3F
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If [Max]1.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.29
10$ 0.18
100$ 0.11
500$ 0.08
1000$ 0.07
Digi-Reel® 1$ 0.29
10$ 0.18
100$ 0.11
500$ 0.08
1000$ 0.07
N/A 17229$ 0.36
Tape & Reel (TR) 3000$ 0.06
6000$ 0.05
9000$ 0.05
15000$ 0.05
21000$ 0.05
30000$ 0.04
75000$ 0.04
150000$ 0.04
NewarkEach (Supplied on Cut Tape) 1$ 0.21
10$ 0.12
25$ 0.11
50$ 0.10
100$ 0.09
250$ 0.08
500$ 0.08
1000$ 0.07

Description

General part information

DAN217 Series

Ultra small mold type package Switching Diode DAN217WM is suitable for high frequency switching applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Diode Flammability

Related Document

EMD3 TL Taping Spec

Datasheet

EMD3 Part Marking

Related Document

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation - Diodes

Package Information

What Is Thermal Design

Thermal Design

DAN217WM Data Sheet

Data Sheet

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Export Regulations

Export Information

Package Dimensions

Package Information

Inner Structure

Package Information

Taping Information

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

Explanation for Marking

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Diode Types and Applications

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Part Explanation

Application Note

What is a Thermal Model? (Diode)

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design