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RB078BM10SFHHTL
Discrete Semiconductor Products

RB078BM10SFHHTL

Active
Rohm Semiconductor

SCHOTTKY RECTIFIER, 110V, 5A, TO-252 ROHS COMPLIANT: YES

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RB078BM10SFHHTL
Discrete Semiconductor Products

RB078BM10SFHHTL

Active
Rohm Semiconductor

SCHOTTKY RECTIFIER, 110V, 5A, TO-252 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRB078BM10SFHHTL
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr6.4 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackageTO-252
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If740 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2480$ 1.91
NewarkEach (Supplied on Cut Tape) 1$ 2.41
10$ 1.77
25$ 1.60
50$ 1.42
100$ 1.26
250$ 1.13
500$ 1.01
1000$ 0.93

Description

General part information

RB078BM10SFHH Series

RB078BM10SFHH is a ultra low IRschottky barrier diode, suitable for Switching power supply. It is a highly reliable product for automotive.

Documents

Technical documentation and resources

RB078BM10SFHHTL | Datasheet

Datasheet

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Select Rectifier Diodes

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Explanation for Marking

Package Information

What Is Thermal Design

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

What is a Thermal Model? (Diode)

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Diodes

Package Information

Diode Types and Applications

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Package Dimensions

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Part Explanation

Application Note

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

Taping Information

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design