
THS6062CDGNR
ObsoleteLOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER
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THS6062CDGNR
ObsoleteLOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | THS6062CDGNR |
|---|---|
| Mounting Type | Surface Mount |
| Number of Drivers/Receivers [custom] | 2 |
| Number of Drivers/Receivers [custom] | 0 |
| Operating Temperature [Max] | 70 °C |
| Operating Temperature [Min] | 0 °C |
| Package / Case | Exposed Pad, 8-TSSOP, 8-MSOP |
| Package / Case [custom] | 0.118 in, 3 mm |
| Protocol | DSL |
| Supplier Device Package | 8-HVSSOP |
| Type | Receiver |
| Voltage - Supply [Max] | 15 V |
| Voltage - Supply [Min] | 5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Texas Instruments | LARGE T&R | 1 | $ 16.04 | |
| 100 | $ 14.01 | |||
| 250 | $ 10.80 | |||
| 1000 | $ 9.66 | |||
Description
General part information
THS6062 Series
The THS6062 is a high-speed differential receiver designed for ADSL data communication systems. Its very low 1.6 nV/), exceeding the distortion requirements of ADSL CODECs. The THS6062 is a voltage feedback amplifier offering a high 100-MHz bandwidth and 100-V/µs slew rate and is stable at gains of 2(-1) or greater. It operates over a wide range of power supply voltages including 5 V and ±5 V to ±15 V. This device is available in standard SOIC or MSOP PowerPAD package. The small, surface-mount, thermally-enhanced MSOP PowerPAD package is fully compatible with automated surface-mount assembly procedures.
The THS6062 is a high-speed differential receiver designed for ADSL data communication systems. Its very low 1.6 nV/), exceeding the distortion requirements of ADSL CODECs. The THS6062 is a voltage feedback amplifier offering a high 100-MHz bandwidth and 100-V/µs slew rate and is stable at gains of 2(-1) or greater. It operates over a wide range of power supply voltages including 5 V and ±5 V to ±15 V. This device is available in standard SOIC or MSOP PowerPAD package. The small, surface-mount, thermally-enhanced MSOP PowerPAD package is fully compatible with automated surface-mount assembly procedures.
Documents
Technical documentation and resources