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8-MSOP Exp Pad Pkg
Integrated Circuits (ICs)

THS6062CDGNR

Obsolete
Texas Instruments

LOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER

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8-MSOP Exp Pad Pkg
Integrated Circuits (ICs)

THS6062CDGNR

Obsolete
Texas Instruments

LOW-NOISE ADSL DUAL DIFFERENTIAL RECEIVER

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationTHS6062CDGNR
Mounting TypeSurface Mount
Number of Drivers/Receivers [custom]2
Number of Drivers/Receivers [custom]0
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / CaseExposed Pad, 8-TSSOP, 8-MSOP
Package / Case [custom]0.118 in, 3 mm
ProtocolDSL
Supplier Device Package8-HVSSOP
TypeReceiver
Voltage - Supply [Max]15 V
Voltage - Supply [Min]5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
Texas InstrumentsLARGE T&R 1$ 16.04
100$ 14.01
250$ 10.80
1000$ 9.66

Description

General part information

THS6062 Series

The THS6062 is a high-speed differential receiver designed for ADSL data communication systems. Its very low 1.6 nV/), exceeding the distortion requirements of ADSL CODECs. The THS6062 is a voltage feedback amplifier offering a high 100-MHz bandwidth and 100-V/µs slew rate and is stable at gains of 2(-1) or greater. It operates over a wide range of power supply voltages including 5 V and ±5 V to ±15 V. This device is available in standard SOIC or MSOP PowerPAD package. The small, surface-mount, thermally-enhanced MSOP PowerPAD package is fully compatible with automated surface-mount assembly procedures.

The THS6062 is a high-speed differential receiver designed for ADSL data communication systems. Its very low 1.6 nV/), exceeding the distortion requirements of ADSL CODECs. The THS6062 is a voltage feedback amplifier offering a high 100-MHz bandwidth and 100-V/µs slew rate and is stable at gains of 2(-1) or greater. It operates over a wide range of power supply voltages including 5 V and ±5 V to ±15 V. This device is available in standard SOIC or MSOP PowerPAD package. The small, surface-mount, thermally-enhanced MSOP PowerPAD package is fully compatible with automated surface-mount assembly procedures.

Documents

Technical documentation and resources