Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | THGBMJG9C8LBAU8 |
|---|---|
| Memory Format | FLASH |
| Memory Interface | eMMC |
| Memory Organization | 64 G |
| Memory Size | 64 MB |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 105 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 153-WFBGA |
| Supplier Device Package | 153-WFBGA (11.5x13) |
| Technology | FLASH - NAND |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 55.93 | |
| Tray | 1 | $ 55.93 | ||
| 10 | $ 49.64 | |||
Description
General part information
THGBMJG9 Series
FLASH - NAND Memory IC 512Gbit eMMC 153-WFBGA (11.5x13)
Documents
Technical documentation and resources