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V62/05601-03ZE
Integrated Circuits (ICs)

V62/05601-03ZE

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Texas Instruments

C2000™ ENHANCED PRODUCT 32-BIT MCU WITH 150 MHZ, 256 KB FLASH, EMIF

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V62/05601-03ZE
Integrated Circuits (ICs)

V62/05601-03ZE

Active
Texas Instruments

C2000™ ENHANCED PRODUCT 32-BIT MCU WITH 150 MHZ, 256 KB FLASH, EMIF

Technical Specifications

Parameters and characteristics for this part

SpecificationV62/05601-03ZE
Clock Rate135 MHz, 150 MHz
InterfaceCAN, UART, SPI, SCI, McBSP
Mounting TypeSurface Mount
Non-Volatile Memory256 MB
Non-Volatile MemoryFLASH
On-Chip RAM36 kB
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Package / Case176-LQFP
Supplier Device Package176-LQFP (24x24)
TypeFixed Point
Voltage - Core1.8 V, 1.9 V
Voltage - I/O3.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 40$ 48.07
Texas InstrumentsJEDEC TRAY (10+1) 1$ 55.28
100$ 49.13
250$ 40.39
1000$ 36.13

Description

General part information

SM320F2812-EP Series

The SM320F2810-EP, SM320F2811-EP, SM320F2812-EP, SM320C2810-EP, SM320C2811-EP, and SM320C2812-EP devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.

Throughout this document, SM320F2810-EP, SM320F2811-EP, and SM320F2812-EP are abbreviated as F2810, F2811, and F2812, respectively. F281x denotes all three Flash devices. SM320C2810-EP, SM320C2811-EP, and SM320C2812-EP are abbreviated as C2810, C2811, and C2812, respectively. C281x denotes all three ROM devices. 2810 denotes both F2810 and C2810 devices; 2811 denotes both F2811 and C2811 devices; and 2812 denotes both F2812 and C2812 devices.

The SM320F2810-EP, SM320F2811-EP, SM320F2812-EP, SM320C2810-EP, SM320C2811-EP, and SM320C2812-EP devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.