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Discrete Semiconductor Products

RD3G07BBGTL1

Active
Rohm Semiconductor

MOSFET, N-CH, 40V, 150A, TO-252 ROHS COMPLIANT: YES

Product thumbnail image
Discrete Semiconductor Products

RD3G07BBGTL1

Active
Rohm Semiconductor

MOSFET, N-CH, 40V, 150A, TO-252 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3G07BBGTL1
Current - Continuous Drain (Id) @ 25°C70 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs56 nC
Input Capacitance (Ciss) (Max) @ Vds3540 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Rds On (Max) @ Id, Vgs2.3 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2968$ 3.34
NewarkEach (Supplied on Cut Tape) 1$ 3.65
10$ 2.55
25$ 2.30
50$ 2.04
100$ 1.79
250$ 1.63
500$ 1.47
1000$ 1.35

Description

General part information

RD3G07BBG Series

RD3G07BBG is a power MOSFET with low on-resistance and high power package, suitable for switching.

Documents

Technical documentation and resources

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Anti-Whisker formation - Transistors

Package Information

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Package Dimensions

Package Information

Moisture Sensitivity Level - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

RD3G07BBG Data Sheet

Data Sheet

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

TO-252_TL1 Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Part Explanation

Application Note

Report of SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Compliance of the RoHS directive

Environmental Data

RD3G07BBG ESD Data

Characteristics Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design