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Discrete Semiconductor Products

RGTVX2TS65DGC13

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Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 60A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

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Search across all available documentation for this part.

Product dimension image
Discrete Semiconductor Products

RGTVX2TS65DGC13

Active
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 60A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTVX2TS65DGC13
Current - Collector (Ic) (Max) [Max]111 A
Current - Collector Pulsed (Icm)240 A
Gate Charge123 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]319 W
Reverse Recovery Time (trr)111 ns
Supplier Device PackageTO-247GE
Switching Energy1.15 mJ, 2.08 mJ
Td (on/off) @ 25°C49 ns, 150 ns
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 9.46
10$ 6.55
25$ 5.80
120$ 4.87
360$ 4.42
600$ 4.25
1080$ 4.08
NewarkEach 1$ 8.07
10$ 6.32
25$ 5.71
50$ 5.38
100$ 5.04
250$ 4.74

Description

General part information

RGTVX2TS65D Series

The RGTVX2TS65D is a 2μs SCSOA guaranteed IGBT, suitable for PFC, solar inverter, UPS, welding and IH. The RGTV/RGW series is a highly efficient series that is optimized the trade-off relationship between conduction loss and switching speed. In addition, optimizing the internal design allowed to achieve smooth switching characteristics that decrease voltage overshoot. It contributes to reduce the number of parts required along with design load.

Documents

Technical documentation and resources

Datasheet

Datasheet

Compliance of the ELV directive

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Moisture Sensitivity Level

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

How to Create Symbols for PSpice Models

Models

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

What Is Thermal Design

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Anti-Whisker formation

Package Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification