SN74AUP2G241DQER
Active2-CH, 0.8-V TO 3.6-V LOW POWER BUFFERS WITH 3-STATE OUTPUTS
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SN74AUP2G241DQER
Active2-CH, 0.8-V TO 3.6-V LOW POWER BUFFERS WITH 3-STATE OUTPUTS
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP2G241DQER |
|---|---|
| Current - Output High, Low [custom] | 4 mA |
| Current - Output High, Low [custom] | 4 mA |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 2 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | 3-State |
| Package / Case | 8-XFDFN |
| Supplier Device Package | 8-X2SON (1.4x1) |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.45 | |
| 10 | $ 0.39 | |||
| 25 | $ 0.36 | |||
| 100 | $ 0.29 | |||
| 250 | $ 0.27 | |||
| 500 | $ 0.23 | |||
| 1000 | $ 0.17 | |||
| 2500 | $ 0.16 | |||
| Digi-Reel® | 1 | $ 0.45 | ||
| 10 | $ 0.39 | |||
| 25 | $ 0.36 | |||
| 100 | $ 0.29 | |||
| 250 | $ 0.27 | |||
| 500 | $ 0.23 | |||
| 1000 | $ 0.17 | |||
| 2500 | $ 0.16 | |||
| Tape & Reel (TR) | 5000 | $ 0.15 | ||
| 10000 | $ 0.14 | |||
| 25000 | $ 0.13 | |||
| 50000 | $ 0.13 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.24 | |
| 100 | $ 0.16 | |||
| 250 | $ 0.13 | |||
| 1000 | $ 0.08 | |||
Description
General part information
SN74AUP2G241 Series
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G241 is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources
