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Discrete Semiconductor Products

YFZVFHTR7.5B

Active
Rohm Semiconductor

500MW 7.5V, SOD-323HE, ZENER DIODE FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsCompliance of the RoHS directiveReliability Test Result+46
Product thumbnail image
Discrete Semiconductor Products

YFZVFHTR7.5B

Active
Rohm Semiconductor

500MW 7.5V, SOD-323HE, ZENER DIODE FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsCompliance of the RoHS directiveReliability Test Result+46

Technical Specifications

Parameters and characteristics for this part

SpecificationYFZVFHTR7.5B
Current - Reverse Leakage @ Vr500 nA
GradeAutomotive
Impedance (Max) (Zzt) [Max]8 Ohms
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case2-SMD, Flat Leads
Power - Max [Max]500 mW
QualificationAEC-Q101
Supplier Device PackageTUMD2M
Voltage - Zener (Nom) (Vz)7.26 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.45
10$ 0.28
100$ 0.17
500$ 0.13
1000$ 0.12
Digi-Reel® 1$ 0.43
10$ 0.30
100$ 0.15
500$ 0.13
1000$ 0.11
N/A 694$ 0.44
Tape & Reel (TR) 3000$ 0.07
6000$ 0.07
NewarkEach (Supplied on Cut Tape) 1$ 0.46
10$ 0.29
25$ 0.23
50$ 0.18
100$ 0.13
400$ 0.13
600$ 0.12
1000$ 0.12

Description

General part information

YFZVFH7.5B Series

YFZVFH7.5B is Zener Diode for voltage regulation. Package is small power mold type and automatic mounting is possible by chip-mounter

Documents

Technical documentation and resources

Compliance of the RoHS directive

Environmental Data

Reliability Test Result

Manufacturing Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Flammability of Materials

Environmental Data

List of Diode Package Thermal Resistance

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions

Package Information

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Low-Side Current Sensing Circuit Design

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

Differences between TVS and Zener Diodes

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

ESD Data

Characteristics Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

What Are TVS Diodes?

Technical Article

YFZVFH7.5B Data Sheet

Data Sheet

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

PCB Layout for TVS Diodes

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Taping Information

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Diode Types and Applications

Technical Article

Selection Method and Usage of TVS Diodes

Technical Article

Anti-Whisker formation - Diodes

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Explanation for Marking

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Export Regulations

Export Information

Moisture Sensitivity Level - Diodes

Package Information

AEC-Q101 Automotive Requirements

Related Document

Technical Data Sheet EN

Datasheet