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Discrete Semiconductor Products

SH8KA7GZETB

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Rohm Semiconductor

MOSFET 2N-CH 30V 15A 8SOP

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Product thumbnail image
Discrete Semiconductor Products

SH8KA7GZETB

Active
Rohm Semiconductor

MOSFET 2N-CH 30V 15A 8SOP

Technical Specifications

Parameters and characteristics for this part

SpecificationSH8KA7GZETB
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C15 A
Drain to Source Voltage (Vdss)30 V
Gate Charge (Qg) (Max) @ Vgs81 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]3320 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs9.3 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.92
10$ 1.59
100$ 1.27
500$ 1.07
1000$ 0.91
Digi-Reel® 1$ 1.92
10$ 1.59
100$ 1.27
500$ 1.07
1000$ 0.91
N/A 1275$ 2.64
Tape & Reel (TR) 2500$ 0.82
5000$ 0.81

Description

General part information

SH8KA7 Series

SH8KA7 is low on-resistance and small surface mount package MOSFET for switching and motor drive application.

Documents

Technical documentation and resources

SOP8 Dual Cu Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Taping Information

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

SH8KA7 Data Sheet

Data Sheet

About Export Regulations

Export Information

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Reliability Test Result

Manufacturing Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Package Dimensions

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Compliance of the RoHS directive

Environmental Data